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  october 2006 rev 1 1/7 7 STPS30100ST power schottky rectifier main product characteristics features and benefits avalanche rated low v f good trade off between leakage current and forward voltage drop high frequency operation avalanche capability specified description single schottky rectifier, suited for high frequency switch mode power supply. packaged in to-220ab, this device is intended to be used in notebook and game station adaptors, providing in these applications a good efficiency at both low and high load. i f(av) 30 a v rrm 100 v t j (max) 150 c v f (typ) 0.385 v a k a to-220ab STPS30100ST a a k k table 1. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 100 v i f(rms) rms forward current 60 a i f(av) average forward current = 0.5 t c = 125 c 30 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 300 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 26400 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink 150 c dptot dtj --------------- 1 rth j a ? () ------------------------- - < www.st.com
characteristics STPS30100ST 2/7 1 characteristics to evaluate the conduction losses use the following equation: p = 0.475 x i f(av) + 0.006 x i f 2 (rms) table 2. thermal resistance symbol parameter value unit r th(j-c) junction to case 1 c/w table 3. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 5 ms, < 2% reverse leakage current t j = 25 c v r = v rrm 175 a t j = 125 c 20 50 ma t j = 25 c v r = 70 v 60 a t j = 125 c 10 20 ma v f (2) 2. pulse test: t p = 380 s, < 2% forward voltage drop t j = 25 c i f = 5 a 0.475 v t j = 125 c 0.385 t j = 25 c i f = 10 a 0.555 t j = 125 c 0.475 t j = 25 c i f = 15 a 0.620 0.660 t j = 125 c 0.525 0.565 t j = 25 c i f = 30 a 0.740 0.800 t j = 125 c 0.605 0.655
STPS30100ST characteristics 3/7 figure 1. conduction losses versus average current figure 2. average forward current versus ambient temperature ( = 0.5) 0 2 4 6 8 10 12 14 16 18 20 22 24 26 0 4 8 12162024283236 p f ( av )( w ) =0.05 =0.1 =0.2 =0.5 =1 t =t /t p t p i (av)(a) f 0 5 10 15 20 25 30 35 0 25 50 75 100 125 150 i f (av)(a) r th(j-a) =r th(j-c) rth(j-a)=15c/w t =t p /t t p t (c) amb figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 0 25 50 75 100 125 150 t (c) j p(t) p (25c) arm p arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. relative variation of thermal impedance junction to case versus pulse duration 0 50 100 150 200 250 300 350 1.e-03 1.e-02 1.e-01 1.e+00 i m (a) tc=25c tc=75c tc=125c i m t =0.5 t(s) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 single pulse z th(j-c) /r th(j-c) tp(s)
characteristics STPS30100ST 4/7 figure 7. reverse leakage current versus reverse voltage applied (typical values) figure 8. junction capacitance versus reverse voltage applied (typical values) figure 9. forward voltage drop versus forward current (high level) figure 10. forward voltage drop versus forward current (low level) 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 0 102030405060708090100 i r ( ma ) tj=150c tj=125c tj=25c tj=100c tj=75c tj=50c v r (v) 100 1000 10000 1 10 100 f=1m h z vosc=30m v tj =25c c(pf) v r ( v) 0 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 i fm (a) tj=25c (maximum values) tj=125c (maximum values) tj=125c (maximum values) tj=125c (typical values) tj=125c (typical values) vfm(v) 0 5 10 15 20 25 30 0.0 0.2 0.4 0.6 0.8 1.0 tj=25c (maximum values) tj=125c (maximum values) tj=125c (maximum values) tj=125c (typical values) tj=125c (typical values) v(v) fm i fm (a)
STPS30100ST package information 5/7 2 package information epoxy meets ul94,v0 in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 4. to-220ab dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.551 b 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 c 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 f 6.20 6.60 0.244 0.259 ?i 3.75 3.85 0.147 0.151 i4 15.80 16.40 16.80 0.622 0.646 0.661 l 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 m2.60 0.102 c b2 c2 f ? i l a a1 a2 b e b1 i4 l3 l2 c1 m
ordering information STPS30100ST 6/7 3 ordering information 4 revision history ordering type marking package weight base qty delivery mode STPS30100ST STPS30100ST to-220ab 2.23 g 50 tube date revision changes 24-oct-2006 1 first issue
STPS30100ST 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2006 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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